OV3660 3MP 24Pin Camera Module Suitable For ESP32-CAM

The OV3660 3MP 24Pin Camera Module is a high-quality and versatile camera module that is specially designed for use with the ESP32-CAM development board. With a resolution of 2048x1536 pixels, this module offers clear and detailed images, making it suitable for both photography and video recording. Its compact size and easy installation process make it a popular choice among hobbyists and professionals alike.

Equipped with a high-performance CMOS sensor, the OV3660 Camera Module ensures accurate and high-quality image capture. It has a maximum frame rate of 15fps and a maximum operating temperature of 70°C, making it suitable for use in a wide range of environments. With its low power consumption and user-friendly design, this camera module is the perfect choice for all your imaging needs. Upgrade your ESP32-CAM development board with the OV3660 3MP 24Pin Camera Module and capture every moment with clarity and precision.

You can use this module to replace OV2640 image sensor of the ESP32-CAM development board.

Specification of OV3660 3MP 24Pin Camera Module Suitable For ESP32-CAM:

• active array size: 2048 x 1536

• power supply:

  • core: 1.5 V ±5%
    (with embedded 1.5 V regulator)

  • analog: 2.6 ~ 3.0 V (2.8 V typical)

  • I/O: 1.8 V/ 2.8 V (1.8 V recommended)

• power requirements:

  • active: 98 mA

  • standby: 20 µA

• temperature range:

  • operating: -20°C to 70°C junction temperature

  • stable image: 0°C to 50°C junction temperature

• output formats: 8/10-bit RAW, RGB and YCbCr output, compression

• lens size: 1/5"

• lens chief ray angle: 27.6°

• inputclockfrequency:6~27MHz

• max S/N ratio: 34 dB

• dynamic range: 70 dB @ 8x gain

• maximum image transfer rate:

  • 2048x1536: 15 fps

  • 1080p: 20 fps

  • 720p: 45 fps

  • XGA (1024x768): 45 fps

  • VGA (640x480): 60 fps

  • QVGA (320x240): 120 fps

• sensitivity: 670 mV/lux-sec

• shutter: rolling shutter

• maximum exposure interval: 1560xtROW

• pixel size: 1.4 µm x 1.4 µm

• image area: 2912 µm x 2167.2 µm

• package/die dimensions:

  • CSP3: 5010 µm x 4960 µm

  • COB: 5000 µm x 4950 µm

For more information, you can read the datasheet of this module.